CBGA植球工艺成熟度提升方法的研究  

A Study on the Promoting Methods of CBGA Bumping Process Maturity

作　　者：黄颖卓[1] 练滨浩[1] 林鹏荣[1] 田玲娟[1] 

机构地区：[1]北京时代民芯科技有限公司,北京100076

出　　处：《电子与封装》2014年第4期9-13,共5页Electronics & Packaging

摘　　要：随着陶瓷球栅阵列(CBGA)封装形式产品被广泛应用,对其植球工艺质量的可靠性和一致性要求也越来越严格,焊球的位置度是检验CBGA产品质量的重要参数之一,其直接影响该产品表面贴装的质量和可靠性。以CBGA256产品为例,针对CBGA产品在批生产过程中出现的局部助焊剂聚集而引起焊球位置偏移的问题,通过对陶瓷外壳质量、焊膏印刷工艺和回流焊工艺的研究,优化CBGA产品的植球工艺,解决局部焊球位置度较差的问题,进而提高产品的一致性和可靠性,提升CBGA植球工艺的成熟度。With ceramic ball grid array package products are widely used, there are increasingly stringent requirements in the reliability and consistency of the bumping process quality. The position accuracy of the solder balls is one of the most important factors to inspect products quality, as it affects the quality and reliability of the product surface mount directly. The paper takes CBGA256 for example, and mainly focus on local flux aggregation of CBGA products during mass-production, which leads to the position of the solder balls lifted. Through the research on ceramic shell quality, solder paste printing process and reflow process, we optimize the bumping process of CBGA products and solve the problem of poor position accuracy of local solder balls, and then improve the consistency and reliability of products, so that we can promote the maturity of CBGA bumping process.

关 键 词：陶瓷球栅阵列 位置度 一致性 工艺成熟度 

分 类 号：TN305.94[电子电信—物理电子学]