印制板铜镀层颗粒的形成与控制  

Formation and Control of Particle Contamination on Copper Plated Coating of Printed Circuit Board

作　　者：王改革[1] 刘秋华[1] 徐杰栋[1] 胡广群[1] 

机构地区：[1]江南计算技术研究所,江苏无锡214083

出　　处：《电镀与精饰》2014年第5期25-27,共3页Plating & Finishing

基　　金：国家重大科技专项课题(2011ZX02709-002)

摘　　要：印制板线路精细化发展趋势对印制板铜镀层表面的平整度要求越来越高,印制板铜镀层表面产生颗粒直接影响线路工作的可靠性。从电镀方面分析了印制板铜镀层表面出现颗粒的原因,并提出相应的控制技术,以确保印制板铜镀层的平整度及电性能的可靠性,满足精细化线路的技术要求。Since the finer trends of PCB, flatness of PCB copper plated coating is in increasingly demanding, any redundant particles on the copper plated coating will directly affect the reliability of PCB circuits. In this paper, causes of the particles formation on copper plated coating surface are analyzed, and appropriate controlling technologies are proposed to ensure flatness of the coating and reliability of the electrical properties, and to satisfy the technical requirements of fine circuits

关 键 词：印制电路板 电镀 铜镀层表面颗粒 

分 类 号：TQ153.14[化学工程—电化学工业]