高可靠性塑封器件质量控制措施  

Quality Assurance of PEM for High-reliability Applications

作　　者：蒋颖丹[1] 梁琦[1] 

机构地区：[1]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2014年第5期14-17,22,共5页Electronics & Packaging

摘　　要：随着塑封器件高可靠性应用日益广泛,塑封产品的研制和生产需求不断增加。分析了塑封器件可能存在的热机械缺陷、腐蚀、爆米花效应,以及生产工艺中可能引入的封装、芯片粘接、钝化层等缺陷,从设计和工艺角度给出控制措施。介绍了国内外高可靠性塑封器件筛选、鉴定检验的典型流程及质量控制措施,用于在生产阶段剔除潜在缺陷的不合格品,保证产品具有高可靠性。With the applications of plastic encapsulated microcircuit（PEM）in high-reliability field increasingly widespread, the demand for development and production of PEM also rises. Possible presence of thermal mechanical defects, corrosion, popcorn effect, as well as the production process which may introduce package, chip bonding problem, passivation defects and so on are analyzed, with control measures from design and process point of view. Both domestic and foreign selection, screening and qualiifcation of high-reliability PEM products are introduced, in order to eliminate the goods with potential pitfalls, and ensure high reliability.

关 键 词：塑封器件 可靠性 质量控制 

分 类 号：TN305.94[电子电信—物理电子学]