真空电弧镀膜中金属液滴的热过程研究  

STUDY ON THERMAL PROCESS OF DROPLETS IN VACUUM ARC DEPOSITION

作　　者：程仲元[1] 邹积岩 

机构地区：[1]南京航空航天大学机电工程学院,华中理工大学电力系

出　　处：《微细加工技术》1996年第4期38-42,共5页Microfabrication Technology

摘　　要：本文建立了真空电弧镀膜中液滴热过程的理论模型，求解了沉积ＴｉＮ膜过程中液滴的温度与粒径变化。计算表明，液滴在飞行过程中温度和粒径不断减小；粒径较小的液滴温度降低较大，甚至可能发生凝固。计算实例能较好解释早期ＴｉＮ膜的电镜分析结果，揭示液滴在薄膜中引起两种不同微孔的机理。A theoretical model has been set up to describe thermal behaviors of liquid droplets in the process of Vacuum Arc Deposition. The model has been numerically solved for temperature and size changes of titanium droplets in VAD processes preparing TiN films. The numerical results show that the temperature and radius of the macroparticles decrease during the flight to substrate. The droplets with smaller initial radius decrease to lower temperatures with more rapid rates. Some of the smaller droplets (<2μm radius) become solidified during the flight. SEM results can be well explained by the numerical sesults. The numerical results give also hints to the mechanism of the formation of two different kinds of microvoids in the films.

关 键 词：真空电弧镀膜 金属液滴 热过程 半导体器件 

分 类 号：TN305.8[电子电信—物理电子学]