硅-玻璃静电键合中的电流-时间特性分析  

Analysis of current-time characteristic in silicon-glass anodic bonding

作　　者：董欣[1] 吴畯苗[1] 邹德恕[1] 史衍丽[1] 邓军[1] 杜金玉[1] 高国[1] 沈光地[1] 

机构地区：[1]北京工业大学北京光电子技术实验室,北京100022

出　　处：《传感器技术》2001年第3期48-50,53,共4页Journal of Transducer Technology

基　　金：国家自然科学基金资助 !(699760 0 4);北京自然科学基金 !(4982 0 0 5 )

摘　　要：在微传感器和微机械结构的静电键合实验中 ,当加电压到键合片对上时 ,外电路的电流迅速上升到一定值后 ,不是逐渐减小 ,而是较缓慢的继续上升 ,或在某一值停留一段时间再逐渐减小到最小值。通过对实验现象的分析 ,认为键合的电流 -时间特性主要是下述两个过程的综合反映 ,键合过程中接触电阻的减小引起的电流增大和空间电荷区形成引起的电流减小 。In the anodic bonding experiment for the micro-sensors and micro-mechanical structures,it is found that the external circuit current gradually increases at a slow speed or stays in a fixed value for a while ,after rising to the fixed value rapidly,and then decreases to a minimal value gradually.After analyzing the phenomenon, we believe that the characteristic of current-time is an integration of two factors:one is the current increase caused by the contact resistance decrease in anodic bonding, he other is the current decrease caused by the establishment of space charge region。These two factors lead to the above phenomenon.

关 键 词：硅-玻璃 静电键合 电流-时间特性 微机械 微传感器 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]