镧对Cu_6Sn_5长大驱动力及焊点可靠性的影响  

Effect of Lanthanum on Driving Force for Cu_6Sn_5 Growth and Improvement of Solder Joint Reliability

作　　者：马鑫[1] 钱乙余[2] Yoshida F 

机构地区：[1]信息产业部电子第五研究所电子元器件可靠性物理及其应用技术国家重点实验室,广东广州510610 [2]哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江哈尔滨150001 [3]广岛大学工学部

出　　处：《中国稀土学报》2001年第4期354-356,共3页Journal of the Chinese Society of Rare Earths

基　　金：日本国际教育交流协会资助项目

摘　　要：在Sn60 Pb40钎料合金中加入微量稀土元素镧可以抑制表面组装焊点界面处Cu6 Sn5金属间化合物的生长 ,进而使焊点热疲劳寿命提高两倍。基于扩散动力学的热力学计算结果表明 ,添加微量稀土元素镧可降低Cu6 Sn5金属间化合物的长大驱动力 ,但存在一个镧的有效局部摩尔分数范围 ,0 18%是其极限值 ,0 0 8%是其最佳值。By means of adding low content of rare earth element La into Sn60 Pb40 solder alloy, the growth of Cu 6Sn 5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by two times. The results of thermodynamic calculation based on diffusion kinetics show that the driving force for Cu 6Sn 5 growth is lowered by adding small content of La in Sn60 Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0 18% is the limited value and 0 08% is the best value.

关 键 词：稀土 镧 Cu6Sn5金属间化合物 焊点可靠性 热力学 铜锡合金 热疲劳寿命 扩散动力学 

分 类 号：TG40[金属学及工艺—焊接]