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作 者:徐向东[1] 洪义麟[1] 田扬超[1] 霍同林[1] 周洪军[1] 陶晓明[1] 傅绍军[1]
机构地区:[1]中国科学技术大学国家同步辐射实验室,合肥230029
出 处:《微细加工技术》2001年第3期22-25,共4页Microfabrication Technology
摘 要:在简述软X射线自支撑透射光栅制作工艺的基础上 ,重点研究支撑结构制作中的紫外光刻和电镀两步工艺。紫外光刻中的菲涅耳衍射会造成光刻胶不能显影到底或起保护作用的光刻胶面积减小、厚度减薄 ;比较了两个不同电镀条件下的电镀实验结果 ,结果表明低的温度和电流密度 ( 40℃、1 .5mA/cm2 )下的镀膜致密、光滑 ,应力小 ,对光栅结构无任何影响 ;高的温度和电流密度 ( 47℃、5.6mA/cm2 )下的镀膜相对粗糙、应力大 ,造成光栅线条的扭曲、并拢 ,甚至拉断光栅线条。The fabricating processes of soft x-ray self-supporting transmission gratings are brieflyintroduced and the emphasises are put on the techniques of UV lithography and microelectroplating in supporting structure fabrication. Fresnel diffraction effect in UV lithography results in photoresist film being removed incompletely, or making a mask of photoresist smaller and thinner than one desired. Microelectroplating experimental results in two different electroplaling conditions are compared. The roughness and stress of platedgold film increase in higher temperature and current density, such as 47℃ and 5.6 mA/cm2, which cause distorting, combining even breaking of the grating lines. But in lower temperature and current density, such as 40℃ and 1.5mA/cm2, the plated gold film is smooth, low stress and dense, which have little effect on the grating lines.
分 类 号:TN253[电子电信—物理电子学]
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