提高硅光电探测器树脂封装可靠性研究  

Enhancement of Resin Package Reliability on Silicon Photodetector

作　　者：孙衍人[1] 林言方[1] 陈华平[2] 

机构地区：[1]杭州大学物理学系 [2]肖山无线电厂

出　　处：《杭州大学学报（自然科学版）》1989年第2期168-172,共5页Journal of Hangzhou University Natural Science Edition

摘　　要：树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。但它的可靠性,特别是抗潮湿性差。本文通过抗潮湿性能分析,比较了几种树脂封装,发现用FS203C+GN522封装可提高其可靠性。Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature. Yet, its reliability and anti-moisture permeability, in particular, is far from adequate. This paper has made a careful study of the ability to anti-moisture permeability by comparing quite a few methods of resin package, we have come to the conclusion that the use of FS203C+GN522 can enhance the reliability.

关 键 词：光电探测器 树脂 封装 有机硅凝胶 

分 类 号：TN364.105[电子电信—物理电子学]