衬底类型对粘贴芯片表面残余应力的影响  

EFFECT OF SUBSTRATE TYPE ON THE EVOLUTION OF RESIDUAL STRESS DURING AND AFTER CURING COB PACKAGES

作　　者：孙志国[1] 黄卫东[1] 罗乐[1] 

机构地区：[1]中国科学院上海冶金研究所,上海200051

出　　处：《金属学报》2001年第12期1281-1284,共4页Acta Metallurgica Sinica

基　　金：国家科技部973资助项目 G1999033108

摘　　要：封装所导致的残余应力是电子器件封装和组装重点关注的问题 本工作利用硅压阻传感器，实时原位地记录了在不同基板材料（ＦＲ４和Ａｌ２Ｏ３陶瓷）上粘接剂固化过程中的应力变化和残余应力的分布状况． 研究表明，在不同基板材料上固化时，应力演化过程不同；Ａｌ２Ｏ３陶瓷基板上芯片的残余应力明显低于ＦＲ４基板．The residual stress induced by packaging has been an common and important problem in the electronic packaging and assembly, Silicon piezoresistive sensor was applied to in - situ record the curing stress profile and the distributions of the the residual stress in chip on board (COB). Results indicate that the residual stress development is related to substrate type, and the average residual stress on aluminum oxide ceramic substrate is lower than that on FR4 substrate.

关 键 词：芯片粘贴 硅压阻应力传感器 残余应力 FR4 氧化铝陶瓷 电子器件 

分 类 号：TN305.93[电子电信—物理电子学] TG404[金属学及工艺—焊接]