微细台阶测量技术的发展现状  

Development of Step Height Measuring Technology

作　　者：白立芬[1] 李庆祥[1] 薛实福[1] 黄成伟[1] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084

出　　处：《电子工业专用设备》2001年第2期1-6,共6页Equipment for Electronic Products Manufacturing

基　　金：国家自然科学基金资助项目 (5 9875 0 5 2 )

摘　　要：微细台阶参数是大规模集成电路和微机械结构制作过程的重要技术指标 ,直接影响器件和构件的特性 ,目前要求台阶测量应具有纳米级精度。概要介绍了台阶测量技术的发展情况 ,阐述了非接触台阶测量和接触式台阶测量技术 ,从测量原理、测量精度与分辨率、适用范围、对被测对象的要求与影响等几方面分析了各种测量方法的特点 ,并得出了结论。Measurement of step parameters is a key testing method in the process of large scale integrated circuit manufacturing.By far,the precision of step height measurement is up to nanometer scale.In this paper,the development of step height measuring technology was introduced in brief,then the non-contact measuring technologies and contact technologies were discussed in detail.The characteristics of every method were analyzed according to the measuring principle,precision and resolution,application,specimen to be measured etc.Then the conclusion was drawn.

关 键 词：微细台阶 纳米技术 接触式测量 非接触式测量 技术发展 集成电路 微机械结构 

分 类 号：TN407[电子电信—微电子学与固体电子学]