惯性微系统封装集成技术研究进展  

Development of Inertial Micro-system Packaging and Integration Technology

作　　者：李男男 邢朝洋[1] LI Nan-nan;XING Chao-yang(Beijing Institute of Aerospace Control Devices,Beijing 100039)

机构地区：[1]北京航天控制仪器研究所,北京100039

出　　处：《导航与控制》2018年第6期28-34,共7页Navigation and Control

摘　　要：随着微机电系统(Micro Electro Mechanical System,MEMS)的器件圆片级封装技术、垂直互连转接板技术、新键合工艺技术等技术研究的出现,惯性微系统正在朝着三维封装集成架构发展,以满足微电子技术更高集成度、更小体积、更低功耗、更低成本的发展需求。介绍了MEMS惯性器件和MEMS惯性微系统三维集成技术,硅通孔(Through Silicon Via,TSV)三维互连技术和倒装芯片技术为惯性MEMS微系统三维集成一体化提供了设计空间,有效地降低了惯性MEMS三维集成模块的体积、质量,提高了集成度,符合未来惯性MEMS三维集成多功能融合趋势的需求。With the development for MEMS devices of wafer-level packaging technology,interposer technique with vertical interconnection and new bonding technology,inertial micro-systems are developing towards 3D package integration architecture to meet the needs of higher integration density,smaller volume,less power consumption and lower cost.This paper introduces the 3D integration technology of MEMS inertial devices and MEMS inertial micro-systems.Through Silicon via(TSV)vertical interconnect technology and flip chip technology are beneficial to 3D integration of inertial MEMS micro-system,which effectively reduce the volume and weight of the inertial MEMS 3D integrated module,and improve the integration density.This approach meets the future trend of inertial MEMS 3D integration of multi-function convergence.

关 键 词：微机电系统 惯性微系统 三维集成 硅通孔 倒装芯片 

分 类 号：U666.1[交通运输工程—船舶及航道工程]