金属微通道结构UV-LIGA精密成形技术研究  

Study on Precise Forming of Metallic Micro-channel by UV-LIGA Technology

作　　者：吕辉 王仁彻[1] 严战非[1] 沈涛 杜立群[2] LV Hui;WANG Ren-che;YAN Zhan-fei;SHEN Tao;DU Li-qun(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China;Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, Dalian University of Technology,Dalian 116024,China)

机构地区：[1]南京电子技术研究所,江苏南京210039 [2]大连理工大学精密与特种加工教育部重点实验室,辽宁大连116024

出　　处：《电子机械工程》2018年第6期39-42,共4页Electro-Mechanical Engineering

基　　金：装备预先研究项目(41423020308)

摘　　要：随着宽禁带功率芯片的使用,电子设备正朝着高性能化、高速度化以及高集成度化的方向发展,因此,高效散热问题亟待解决。微尺度通道内液体特殊的流动特性、尺度效应,可集中散发大量热量,为电子设备高效能散热开辟新的途径。文中针对金属微通道散热单元,开展金属微通道结构UV-LIGA精密成形关键技术研究,突破了大厚度胶膜图形制备和铜微结构精密电铸成型技术难点,成功制备了特征宽度为100μm,深宽比不小于5的铜质微通道基板样件,实现金属微通道构件高效率、高质量成形。With the use of wide band gap power chip,electronic equipment is developing towards the direction of high performance,high speed and high integration,while the problem of high-efficiency heat dissipation is urgent to be solved.The special flow characteristics and scale effect of liquid in the micro-channel can centrally distribute a large amount of heat,which opens up a new way for high-efficiency heat dissipation of electronic equipment.The key technology of UV-LIGA precision forming for metal micro-channel heat dissipation unit is studied in this paper,which breaks through the technical difficulties of large thickness film patterning and the precision electroforming of copper microstructures.Samples of copper micro-channel substrates with a characteristic width of 100 μm and a depth to width ratio more than 5 has been successfully prepared,and high efficiency and high quality forming of metal micro-channel components has been realized.

关 键 词：金属微通道 厚胶膜 光刻 微电铸 

分 类 号：TN405[电子电信—微电子学与固体电子学]