电容式微传声器的制备研究新进展  

Recently Development in the Fabrication of Capacitive Microphone

作　　者：宁瑾[1] 刘忠立[1] 赵慧[1] 

机构地区：[1]中国科学院半导体研究所微电子中心,北京100083

出　　处：《电子器件》2002年第1期9-13,共5页Chinese Journal of Electron Devices

摘　　要：本文对近几年来运用单片制备方法 ,采用硅微机械加工技术 (MEMS)工艺研制的电容式微传声器进行了详细描述。通过分析和研究指出 ,将微传声器与其外围电路集成在单片上可降低器件噪声 ,采用纹膜或复合膜结构可增加器件的灵敏度 ,根据具体情况优化电极形状和尺寸 。In this paper, a review of single wafer fabricated capacitive silicon microphones based on micromechanic systyms is given. The integration of a capacitive microphone and detection circuits will result in a further reduction of the noise. The application of corrugated or composite diaphragms offers the possibility to increase the sensitivity of microphone. The optimization of capacitor electrode shaping will improve the performance of microphone by increasing the sensor sensitivity and the signal noise ratio.

关 键 词：电容式微传声器 微机械加工技术 制备 

分 类 号：TN641[电子电信—电路与系统]