基于SOI技术高温压力传感器的研制  

Research on High Temperature Pressure Sensor Based on SOI

作　　者：陈勇[1,2] 郭方方[3] 白晓弘[1,2] 卫亚明[1,2] 程小莉[1,2] 赵玉龙[3] 

机构地区：[1]长庆油田油气工艺研究院,陕西西安710018 [2]低渗透油气田勘探开发国家工程实验室,陕西西安710018 [3]西安交通大学机械学院机械制造系统工程国家重点实验室,陕西西安710049

出　　处：《仪表技术与传感器》2014年第6期4-6,共3页Instrument Technique and Sensor

基　　金：国家863计划项目(2011AA040401)

摘　　要：针对油气田等领域高温高压环境要求,介绍了一种高温压力传感器芯片的设计及研制,设计的高温压力传感器芯片解决了传统压阻式传感器在高温高压环境下的热稳定性问题。通过静电键合封装技术将耐高温SOI压阻芯片与玻璃片在真空环境下封装结合为一体,作为全硅结构的压力传感器的弹性敏感单元,解决高温环境下测量大量程压力的难题。同时,采用高温充硅油技术,用波纹片和高温硅油将被测量介质隔离开来,提高了传感器的适应能力。In order to suit for the special requirements of the oil and gas fields,in this paper,the design and fabrication of a high-temperature pressure sensor chip was described.The textual sensor chip was designed to accomplish the thermostability in the high temperature environment which the traditional sensor cannot suit for.High-temperature SOI piezoresistive chip was packed with glass by anodic bonding in vacuum environment,which was used as the sensitive element of the pressure sensor.The requirements of wide-range pressure for the oil and gas fields was resolved by this design.Moreover,the pressure sensor chip was insulated from measured medium by high-temperature silicone oil filling technology,adaptability of sensor was improved.

关 键 词：高温压力传感器 硅隔离 静电键合 波纹膜片 封装 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]