非晶Ni-Cu-P合金化学沉积过程的多重分形谱研究  

Multifractal of the deposition process of amorphous electroless Ni-Cu-P alloy

作　　者：于会生[1] 孙霞[2] 罗守福[1] 王永瑞[1] 吴自勤[2] 

机构地区：[1]上海交通大学材料科学与工程学院,上海200030 [2]中国科学技术大学基础物理中心,合肥230026

出　　处：《物理学报》2002年第5期999-1003,共5页Acta Physica Sinica

基　　金：国家"九五"科学仪器科技攻关 (批准号 :96 A2 3 0 0 2 )资助的课题~~

摘　　要：用原子力显微镜测定了Si TiN Pd基体 ,经不同沉积时间得到的非晶Ni 13.1wt%Cu 9.3wt%P薄膜的表面形貌 ,得到了AFM图像的多重分形谱 .结果表明 :随着沉积时间的增加 ,多重分形谱的宽度增加 ,Δf(Δf =f(αmin) -f(αmax) )增大 .说明沉积表面高度分布随着沉积时间的增加 ,不均匀性显著增加 ,镀层在水平和垂直方向生长并逐渐形成连续致密的镀层 .The surface topographies of Si/TiN/Pd substrate and amorphous electroless Ni-13.1wt% Cu-9.3wt% P alloy deposited in various time were measured with an atomic force microscope (AFM). Multifractal spectra f(α) show that the longer the deposition time, the wider the spectrum, and the larger the Δf(Δf=f(α min)-f(α max)).It is apparent that the nonuniformity of the height distribution increases with increasing deposition time, and the nodules of Ni-Cu-P alloy grow in both borizontal and vertical directions. These results show that the AFM images can be characterized by the multifractal spectra.

关 键 词：多重分形谱 NI-CU-P合金 化学沉积 AFM图像 非晶合金 化学镀层 镍铜磷在元合金 

分 类 号：TQ153[化学工程—电化学工业]