难镀基材化学镀镍  

Electroless Nickel Plating on Difficult-to-Plate Substrates

作　　者：李立明[1] 胡文彬[2] 罗守福[2] 沈彬[2] 

机构地区：[1]郑州电力高等专科学校动力系,郑州450004 [2]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《电镀与环保》2002年第3期13-17,共5页Electroplating & Pollution Control

摘　　要：从化学镀镍出发 ,根据难镀基材的特性对难镀基材作了分类 ,并阐明了各种难镀基材难镀的原因。For electroless nickel plating(EN), a classification is made to diffcult to plate substrates according to their characteristics. The causes for difficult plating on these substrates are analyzed, and the solutions are suggested in principle and practice.

关 键 词：化学镀镍 难镀基材 镀镍 

分 类 号：TQ153.12[化学工程—电化学工业]