MCU芯片Multi-Sites测试中几个值得关注的问题  

Some Focus Issues in MCU Chip Multi-Sites Testing

作　　者：陈真[1,2] 陆锋[2] 张凯虹[2] 

机构地区：[1]江南大学物联网工程学院,江苏无锡214122 [2]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2014年第6期12-14,共3页Electronics & Packaging

摘　　要：介绍了MCU芯片Multi-Sites测试方法,针对MCU芯片Multi-Sites测试的难点,阐述了在MCU芯片Multi-Sites测试过程中经常影响测试系统和测试效率的问题。主要提出了MCU芯片MultiSites测试过程中的直流参数测试、功能测试的影响因素和解决方案,并对MCU芯片Multi-Sites测试过程中经常遇到的干扰因素进行分析,尽可能保证MCU芯片Multi-Sites测试过程中获得的各项性能参数稳定可靠。Describes the MCU chip Multi-Sites Test Method for Multi-Sites MCU chip test difficulty, elaborated MCU chip Multi-Sites in the testing process often affects the efficiency of the test system and test problems, mainly made MCU chip testing process Multi-Sites the DC parametric testing, functional testing of influencing factors and solutions, and the MCU chip Multi-Sites often encountered during testing interference factors were analyzed, as far as possible to ensure the MCU chip Multi-Sites obtained during testing of the performance parameters stable and reliable.

关 键 词：MCU Multi—Sites 直流参数测试 功能测试 

分 类 号：TN407[电子电信—微电子学与固体电子学]