自动金丝球焊工艺中第一键合点成球缺陷分析  

The Analysis of First Bonding Defects in Automatic Gold Ball Bonding

作　　者：王姜伙[1] 金家富[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《电子与封装》2014年第2期13-15,共3页Electronics & Packaging

基　　金：装备预先研究项目(51318070119)

摘　　要：引线键合在多芯片微波组件微组装上应用广泛,通常会用金丝实现芯片与基板、基板与基板间的互连。自动金丝球焊是互连方法的一种,它具有生产效率高、一致性好的特点。文章针对在生产过程中出现的第一键合点成球缺陷展开原因分析,即键合工艺参数不当、真空系统故障和线夹间距不当等。系列试验验证,线夹间隙不当可造成上述缺陷,解决该问题的办法是将线夹间隙调整到0.05 mm。Wire bonding process is widely used in microwave multi-chip module for joining chip to substrate or substrate to substrate with gold wire. As one of connecting methods, automatic gold ball bonding has high production efficiency and good consensus. In order to solve first bonding defects in automatic gold ball bonding, this article expands the reason analysis, which includes the wrong settings of bolding parameters, failure of vacuum system, false space between wire clamps. Series experiments indicate that false space between wire clamps may cause the defects. Adjusting the space to 0.05 mm is a good way to solve this problem.

关 键 词：自动金丝球焊 成球缺陷 线夹 

分 类 号：TN305.94[电子电信—物理电子学]