混合微电路内部水汽含量控制技术  

Moisture Content Control Methods for Hybrid Electronic Device

作　　者：谈侃侃[1] 杨世福 李茂松[1] 倪乾峰[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060 [2]重庆美亚电子有限公司,重庆400060

出　　处：《微电子学》2014年第4期546-549,554,共5页Microelectronics

摘　　要：根据气密性封装混合微电路内腔残余气体数据的测试结果,对水汽含量超标的样品进行了深入分析。提出了一种阻断分离法,可用于分析混合微电路水汽失效的原因。采用该方法,对可能引起水汽失效的外壳密封性问题、粘结胶放气问题,以及内部元器件及组装材料放气问题分别进行了试验验证与组合分析,找到了与水汽失效相关的各种原因及控制办法。根据试验分析结果,系统地提出了控制混合微电路内部水汽及其他杂质含量的有效方法。According to the testing results of residual gas in the hybrid circuit cavity with hermetic package, the samples with the water vapor content over standard were analyzed in detail. A kind of segregating method was proposed to analyze the cause of the water vapor failure of hybrid circuit. Experimental verification and combinatorial analysis were carried out respectively with this method aiming at the problems of package shell hermetic, adhesive releasing gas and internal components and assembly materials producing gas which may lead to the water vapor failure. Based on the experimental results, an effective method was systematically put forward for controlling internal water vapor and other impurities content.

关 键 词：混合电路 水汽含量 气密性封装 

分 类 号：TN305.94[电子电信—物理电子学]