LED芯片键合材料研究述评  

LED Die Bonding Materials

作　　者：张保坦[1] 孙蓉[1] 汪正平[2] 

机构地区：[1]中国科学院深圳先进技术研究院,深圳518055 [2]香港中文大学,香港999077

出　　处：《集成技术》2014年第6期1-7,共7页Journal of Integration Technology

基　　金：广东省引进创新科研团队计划(2011D052);深圳市孔雀计划团队(KYPT20121228160843692);深圳市电子封装材料工程实验室(深发改【2012】372号)

摘　　要：发光二极管(LED)是一类可直接将电能转化为可见光和热等辐射能的发光器件。随着亮度和功率的不断提高,芯片键合材料成为解决大功率LED散热问题的关键技术之一。针对LED对芯片键合材料的性能要求,文章综述了LED芯片键合材料的种类、特点及发展现状,并重点介绍了环氧和有机硅材料的应用技术进展。LED is the abbreviation of light emitting diode, which is a kind of semiconductor materials that can transform electrical energy into visible light. With the improvement of LED brightness and efficiency, the die bonding materials have become one of the key technologies which are used to deal with heat management for LED. In this paper, the types, characteristics and development of LED die bonding materials developed for the performance requirements of LED packaging, especially the epoxy and silicone materials, were summarized.

关 键 词：键合材料 环氧 有机硅 共晶材料 

分 类 号：TN312.8[电子电信—物理电子学]