集成电路工艺中减薄与抛光设备的现状及发展  

The Trends and the State of Grinding Technology and Polishing Productionsin IC Manufacturing

作　　者：费玖海[1] 杨师[1] 周志奇[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《电子工业专用设备》2014年第2期6-10,共5页Equipment for Electronic Products Manufacturing

摘　　要：晶圆加工是单晶硅衬底和集成电路制造中的关键技术之一,为了得到更稳定的硅片,提高其平整度和表面洁净度,国内外技术人员越来越注重减薄与抛光设备的研究与改进。介绍了针对硅片平坦化工艺的减薄设备及现阶段加工过程中防止碎片的技术方法;介绍了化学机械抛光设备的技术发展现状以及针对硅片抛光的后清洗工艺。Silicon substrate processis one of core technology in IC fabrication. For steady and better surface of silicon wafer,Researchers are paying more and more attentions on the structures of Grinding and Polishing. This paper introduces the technology of silicon substrate actuality. Mainly about the measure of decreasing wafer scrap. Analyzes the technology and development of the polishing and cleaning process of silicon wafer.

关 键 词：集成电路 硅片 减薄 

分 类 号：TN305.2[电子电信—物理电子学]