MLCI端电极缺陷引起的立碑问题研究  

Tombstone problem study caused by the defect of MLCI terminal electrode

作　　者：张育龙 施威 王胜刚 杨邦朝[2] 

机构地区：[1]深圳振华富电子有限公司,广东深圳518109 [2]电子科技大学微电子与固体学院,四川成都610054

出　　处：《电子元件与材料》2014年第12期86-88,共3页Electronic Components And Materials

摘　　要：针对叠层片式电感器(MLCI)在回流焊过程中发生的立碑现象,通过对正常样品与立碑样品的SEM显微观察和对比分析,论述了MLCI本身缺陷引起的焊接立碑机理。结果表明:MLCI端电极内部银层不致密、孔洞多导致了元件回流焊时产生立碑。最后通过生产实例提出了一个解决此问题的方案。Aimed at MLCI tombstone phenomenon occurred in reflow soldering process, the microscopic observation and comparative analysis of normal samples and tombstone samples were studied with SEM, and the mechanism of tombstone in soldering caused by MLCI defect itself was discussed. The results show that the silver layer with many holes in the MLCI terminal electrode is not dense, resulting in the component tombstone during reflow soldering. Finally, a solution to this problem is proposed through the production instance.

关 键 词：MLCI 立碑 回流焊 端电极 银层 烧银工艺 

分 类 号：TM55[电气工程—电器]