压延铜箔生产工艺概述  

Overview of the Production Process on Rolled Copper Foil

作　　者：田军涛[1] 

机构地区：[1]中国瑞林工程技术有限公司,江西南昌330032

出　　处：《上海有色金属》2014年第4期170-176,182,共8页Shanghai Nonferrous Metals

摘　　要：综述了国内外压延铜箔的生产现状,分析了压延铜箔的生产工艺和关键技术,指出厚度控制、表面质量和表面处理是铜箔生产的关键环节,全面、全过程和全员参与的质量管理制度是压延铜箔生产的保证;介绍了电子铜箔的种类、应用领域和工业标准;综合对比了电解铜箔与压延铜箔的性能,与电解铜箔相比,压延铜箔具有更好的延伸性和耐折性,更高的软化温度和强度,更低的表面粗糙度,指出压延铜箔是制造挠性印刷线路板基板的关键材料.Following an introduction of the production of rolled copper foil worldwide, the production process and key technology of the rolled copper have been analyzed, in which the thickness control, surface quality and surface treatment are the essential processes. The all-round quality management guarantees the production of rolled copper foil. In addition, based on the applications and industrial standards of electronic foil, a comprehensive comparison has been made on various properties between the electrolytic copper foil and rolled copper foil. Comparatively, roiled copper foil has better extensibility and folding resistance, higher softening temperature and strength, lower surface roughness, which is one of the key materials in manufacturing flexible printed circuit board substrate.

关 键 词：压延铜箔 挠性印刷线路板 电解铜箔 生产工艺 关键技术 

分 类 号：TN41[电子电信—微电子学与固体电子学]