一种新型单组分导电胶在薄膜混合集成电路中的应用  

Applications of One - component Electrically Conductive Adhesive in Thin Film Hybrid Integrated Circuit

作　　者：童洋[1] 周婷[1] 车江波[1] 潘园园[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2014年第3期14-20,共7页Hybrid Microelectronics Technology

摘　　要：随着薄膜混合集成电路可靠性要求不断加强，薄膜混合集成电路组装材料的可靠性要求也随之加强。现有的双组分导电胶在粘接强度、体电阻率等性能上难以满足薄膜混合集成电路高可靠组装的要求。本文研究了单组分导电胶粘接工艺在薄膜混合集成电路中的应用。根据组装工艺特点，研究了该导电胶与薄膜金属化膜系之间的粘接工艺以及与现有的双组分导电胶在水汽释放含量、粘接强度、体电阻率等方面的优劣对比，最终论证了该型单组分导电胶能够满足高质量等级混合集成电路高可靠性的要求。As the reliability requirements of thin film hybrid integrated circuit are improved constantly, the reliability of thin film hybrid integrated circuit assembly materials are being enhanced. The available two - component conductive adhesive with ad- hesive strength and volume resistivity ratio can not meet the high reliable assembly requirements of thin film hybrid integrated cir- cuit. In this paper, the application of one -component conductive adhesive in thin film hybrid integrated circuit is studied. Accord- ing to features of the assembly process, the adhesive process of the conductive adhesive wih thin - film metallization system is studied, also with comparsion between moisture release contents, adhesive strength and volume resistivity ratio for available two - component conductive adhesive. It is demonstrated that one - component conductive adhesive can meet the requirement of high re- liability assembly of thin film hybrid integrated circuit.

关 键 词：薄膜混合集成电路 粘接 单组分导电胶 

分 类 号：TQ437.3[化学工程]