一种IGBT热阻测试系统的研制  

Research and Implementation of an IGBT Thermal Resistance Test System

作　　者：陈君[1] 张小玲[1] 谢雪松[1] 田蕴杰 袁芳[1] 杨友才[1] 

机构地区：[1]北京工业大学电子信息与控制工程学院,北京100124

出　　处：《半导体技术》2015年第1期68-72,共5页Semiconductor Technology

摘　　要：为了解决国内绝缘栅双极型晶体管(IGBT)生产和使用中热阻测试问题,采用电学法的测量原理并与嵌入式技术相结合的方式,设计了一种以现场可编程门阵列(FPGA)为控制核心的IGBT自动测试系统。该系统采用模块化的设计思想,各模块间进行隔离设计,其中14 bit隔离型高速数据采集卡可以快速采集IGBT温度敏感参数的变化,从而使系统可以快速可靠的工作。使用该测试系统对IGBT器件的热特性进行测试,将测试数据与美国生产的Phase11热特性分析仪进行对比,测试结果经过修正后误差约为1%。验证了该热阻测试系统可用于测试IGBT器件的热特性,并具有速度快、稳定性好等优点,对我国功率器件的可靠性技术研究具有重要意义。In order to solve the thermal resistance test problems in production and application of the domestic insulated gate bipolar transistor （IGBT） , the thermal resistance automatic test system was designed. The design of the system was based on the field-programmable gate array （FPGA） control technology, by using the thermal resistance electrical measurement method combined with the embedded technology. The system involved several function modules, and the modules were designed for isolating with each other. In this system, a 14 bit isolated high-speed data acquisition card was adopted, which can quickly capture the changing of IGBT temperature-sensitive parameters, so the system can work quickly and reliably. The test system was used to test the thermal characteristics of IGBT devices, compared the test results with the Phase 11, the error is about 1% after correction. The test results show that the thermal resistance test system can be used to measure thermal characteristics of IGBT devices rapidly and stability. It is significant for the research of the power devices reliability.

关 键 词：绝缘栅双极型晶体管(IGBT) 热阻 结温 电学法 测试系统 

分 类 号：TM934.1[电气工程—电力电子与电力传动] TN322.8[电子电信—物理电子学]