快干型无溶剂复合导电胶的研制  

Development of Quick-Drying and Solvent-Free Composite Conductive Adhesive

作　　者：张强[1] 黄虹[1] 汪洋[1] 

机构地区：[1]武汉材料保护研究所,湖北武汉400030

出　　处：《上海涂料》2015年第1期5-9,共5页Shanghai Coatings

摘　　要：研制了一种以无溶剂改性环氧树脂为基体树脂,添加潜伏型固化剂和片状镀银铜粉导电填料的快干型复合导电胶。研究了填料的添加量与粒径、湿热环境、高温时间等因素对导电胶导电性能及粘接强度的影响。A kind of quiek-drying composite conductive adhesive was developed by modified solvent-free epoxy resin as base material with addition of latent curing agent and flake silver plated copper powders as conductive filler. The influences of amount and particle size of filler, damp heat environment, high temperature time on the conductive properties and bond strength of conductive adhesive were researched.

关 键 词：改性环氧树脂 镀银铜粉 导电胶 体积电阻率 导电性能 

分 类 号：TQ433.437[化学工程]