工业级FPGA空间应用器件封装可靠性分析  

Reliability analysis on package of industry FPGA for space application

作　　者：吕强[1] 尤明懿[1] 郭细平[1] 陆安南[1] 杨小牛[1] 

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314033

出　　处：《电子元件与材料》2015年第2期69-73,共5页Electronic Components And Materials

摘　　要：分析了工业级和宇航级FPGA(Field Programmable Gate Array)在封装结构上的差别。用Ansysworkbench有限元软件对热循环、随机振动和外力载荷下封装的变形和应力以及焊点的塑性应变进行了仿真。依据剪切塑性应变变化范围预测了焊点热疲劳寿命。结果表明,FCBGA(Flip-Chip Ball Grid Array)封装内部倒装芯片焊点可靠性低于CCGA(Ceramic Column Grid Array)封装,其外部焊点的热疲劳寿命、随机振动等效应力均优于CCGA封装;在外力载荷下,其热疲劳寿命下降速率也明显小于CCGA封装。The difference of FPGA package structures between industry and aero space application was discussed. The total deformation, equivalent stress of the package and the equivalent plastic strain of the solder under thermal cycling, random vibration and compressive load were simulated by using the finite element software Ansysworkbench. Solder thermal fatigue life was predicted by shear plastic strain range. The results show that the reliability of flip-chip solder of FCBGA package is lower than CCGA package, the thermal fatigue life and random vibration equivalent stress precede CCGA package. The descend speed of thermal fatigue life is also less than CCGA package under compressive load obviously.

关 键 词：工业级FPGA 封装结构 可靠性 热疲劳寿命 随机振动 空间应用 

分 类 号：TN604[电子电信—电路与系统]