超声扫描显微镜检查在倒装器件检测中的应用  

The Application of Scanning Acoustic Microscope Inspect in Flip-chip Device Test

作　　者：潘凌宇 张吉 杨城 马清桃 王伯淳 

机构地区：[1]湖北航天计量测试技术研究所,湖北孝感432000 [2]中国航天科工集团元器件可靠性中心四院分中心,湖北孝感432000

出　　处：《电子与封装》2014年第11期41-44,共4页Electronics & Packaging

摘　　要：随着倒装器件在型号产品中使用越来越广泛,倒装器件在使用过程中也暴露出一些问题,如底充胶分层、焊点空洞以及裂纹等,这些缺陷均能导致倒装器件失效。总结了几种倒装器件超声扫描的缺陷,重点对底充胶以及焊点进行分析。同时,论述了倒装器件超声检测中内部界面缺陷的辨别以及原理。With the widespread use of the lfip-chip devices in production, the lfip-chip device in using also exposed some problems. For example, the lfip-chip device has delamination in underifll and voids or cracks in solder bumps, etc. All of those defects could cause the lfip-chip device failure. The paper collected the some SAM defects of lfip-chip devices and focused discussion on underifll and bumps. At the same time, this paper discussed discrimination and principle, etc.

关 键 词：倒装器件 超声扫描显微镜 底充胶 

分 类 号：TN306[电子电信—物理电子学]