Ka波段微带滤波器的仿真与测试  被引量:4

Simulation and testing of Ka-band microstrip filter

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作  者:邓庆文[1] 范童修[1] 卢胜军[1] 

机构地区:[1]中国电子科技集团公司第36研究所,浙江嘉兴314033

出  处:《现代电子技术》2015年第5期149-151,共3页Modern Electronics Technique

摘  要:微带滤波器在电子工程领域有很重要的应用,设计了一款Ka波段微带滤波器并通过测试夹具研究键合线及键合微带线间隙对其性能的影响。结合电磁仿真结果与实测结果发现:键合金丝及键合微带线间隙在高频条件下引入的寄生参数恶化滤波器的驻波,通过提取相应的等效参数,并对键合端点进行阻抗匹配,再次进行电磁场仿真,结果表明滤波器的驻波有了明显的改善。Microstrip filters are widely used in the electronic engineering field. A Ka-band microstrip filter was designed and tested for the target to investigate return loss and insertion loss from bonding wire and gap between bonding microstrip wires. The results show that the gap between gold bonding wire and microstrip wire may deteriorate the standing wave of the filter if parasitic parameter is introduced under the condition of high frequency. After the equivalent parameters was extracted and impedance was matched at the bonding endpoint, another electromagnetic field simulation was carried out. The result indicates that the standing wave of the filter is improved obviously.

关 键 词:微带滤波器 键合线 ADS HFSS 寄生参数 

分 类 号:TN713-34[电子电信—电路与系统]

 

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