无机添加剂对银通孔浆料烧结渗透行为的影响  

Effect of inorganic additives on the sintering permeation behavior of silver via fill paste

作　　者：金勿毁[1] 陈立桥[1] 吕刚[1] 李俊鹏[1] 罗慧[1] 

机构地区：[1]昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,云南昆明650106

出　　处：《电子元件与材料》2015年第3期16-19,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助(No.51261008);昆明市科技局高新技术研究与开发项目资助(No.2013-02-02-A-G-02-3040)

摘　　要：采用扫描电镜直接观察的方法,研究了氧化物或玻璃粉添加于通孔银浆中对浆料与Ferro A6生料带共烧行为的影响。结果表明,不加入无机添加剂时,生料带中的低熔点物相会向银通孔电极中渗透;质量分数10%的Si O2添加可阻碍渗透发生,并在电极与陶瓷孔界面处形成一个凸起的过渡层;用玻璃粉代替Si O2添加时,则发生反向渗透现象;在浆料中添加质量分数1%~4%的玻璃粉,则可以有效阻止低熔点物相的流渗,浆料的方阻也满足组件对银通孔浆料电学性能的要求。The influences of oxides and glass frits on the co-fired behavior between Ferro A6 tape and silver via fill paste were studied through scanning electron microscopy （SEM） observation. The results show that the low melting phase from Ferro A6 tape penetrates into silver via fill electrode in the absent of inorganic additive; the addition of 10% （mass fraction） SiO2 into Ag paste could prevent the permeation to hole and form a transition bulge loop at the interface; the reversal permeation oceurres when 10% （mass fraction） glass frits were added instead of SiO2. 1%--4% （mass fraction） glass frits avoide the inter-permeation of low melting phase from either conductive electrode or green tape, and their sheet resistance values meet the reouirement of electrical properties.

关 键 词：低温共烧陶瓷 银通孔浆料 无机添加剂 烧结 渗透 玻璃粉 

分 类 号：O614.122[理学—无机化学]