用于PCB基板的高耐热性电解铜箔的表面处理  

Surface Treatment of High Heat Resistance Electrolytic Copper Foil Used for PCB

作　　者：简志超[1] 彭永忠[1] 

机构地区：[1]江西铜业集团公司国家铜冶炼及加工工程技术研究中心,南昌330096

出　　处：《有色金属工程》2015年第2期20-22,60,共4页Nonferrous Metals Engineering

摘　　要：研究高耐热电解铜箔表面处理工艺,依次进行粗化、固化、电镀Zn-Ni-Co三元合金、铬酸盐钝化、浸有机膜等工序,分析主要工序工艺参数的影响。结果表明,处理后的铜箔毛面呈暗红色,不含砷和六价铬等有害元素,具有优异的抗剥离强度以及耐热性、耐腐蚀和蚀刻性能,可以替代同类型的进口铜箔,应用于压制耐热板、无卤板和多层板。The surface treatment technology of high heat resistance electrolytic copper foil is investigated. It is operated in sequence of coarsening, curing, Zn-Ni-Co based ternary alloy electroplating,chromate passivating, dipping for organic film. The influences of the main process parameters are analyzed. The results show that the treated copper foil has a black smooth surface,without harmful elements such as Cr6 ＋and As,with the excellent anti-peel strength and resistance to oxidation,corrosion and etching. Furthermore,the treated copper foil can replace the same type of imported copper foil for manufacturing heat-resistant,halogen free board and multilayer board.

关 键 词：电解铜箔 PCB基板 表面处理 耐热无卤板 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG174.44[金属学及工艺—金属材料]