陶瓷封装中贴片胶溶剂扩散的研究  

Research of Die Attach Adhesive Bleed out in Ceramic Packaging

作　　者：葛秋玲 陈陶 

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2015年第3期5-8,34,共5页Electronics & Packaging

摘　　要：在微电子行业中,使用贴片胶粘接是一种常见的贴片方法。但该贴片工艺很容易发生溶剂扩散现象,严重的时候甚至会影响后续的组装工艺,该问题在陶瓷外壳上表现得更显著。研究并详细说明溶剂扩散的产生原因和影响关系,重点研究贴片胶在陶瓷外壳金属化表面上的溢出行为。最后,对于溶剂扩散问题给出了定义及相关的解决方法。The use of die attach adhesive is an established practice in the micro-electronics industry. A problem which has plagued this die attach method is the phenomena of resin bleed out from the epoxy. When severe, this resin separation can interface with subsequent assembly process. Particularly susceptible to this effect are ceramic chip carriers. The objective of this investigation is to define the cause and effect relationship involved with epoxy bleed out. The article focuses on the behavior of die attach adhesive when applied to the metalized surfaces in ceramic chip carriers. The results of the experiments lead ultimately to a definition and solution of the bleed out problem.

关 键 词：溶剂扩散 扩散机理 陶瓷封装 

分 类 号：TN305.94[电子电信—物理电子学]