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作 者:张启沛[1] 钟喜春[1] 李春明[1] 匡同春[1] 郭燕伶[2]
机构地区:[1]华南理工大学材料科学与工程学院,广州510640 [2]广州番禺职业技术学院,番禺511483
出 处:《真空科学与技术学报》2015年第4期444-450,共7页Chinese Journal of Vacuum Science and Technology
基 金:中央高校基本科研业务费专项资金(2013ZM033);广东省科技计划项目(2011B010300017)
摘 要:采用磁过滤电弧离子镀(MFAIP)方法在高速钢表面制备了Ti N薄膜,采用扫描电子显微镜、X射线衍射仪,显微硬度计和划痕仪等方法研究了偏压和磁过滤电流对Ti N薄膜的形貌、沉积速率、组织结构和力学性能的影响。结果表明:MFAIP-Ti N薄膜膜层均匀,表面质量好,膜与基体结合紧密。随着偏压和磁过滤电流的增加,Ti N的(111)晶面择优取向越来越弱,(311)和(222)晶面的择优取向逐渐增强。当偏压为-150 V,磁过滤电流为4.5 A时,表现出较大的沉积速率,最大的显微硬度测试值和最大的膜/基结合力。The TiN coatings were deposited by magnetic filtered arc ion plating( MFAIP) on substrates of highspeed steel. The impact of the growth conditions,including but not limited to the bias voltage,magnetic filtered( MF) current,ratio of Ar/N2 flow rates and deposition rate,on the microstructures and mechanical properties of the surface and interface was investigated with scanning electron microscope,X-ray diffraction and conventional mechanical probes. The results show that depending on the bias voltage and MF current,the smooth,compact TiN coatings were deposited with improved surface mechanical properties and interfacial adhesion. For instance,as the bias and MF current increased,its( 111) preferential growth orientation was weakened,accompanied by the increasingly pronounced( 311) and( 222) orientations. Synthesized at- 150 V and 4. 5 A,the TiN coatings displayed the highest surface micro-hardness and the strongest interfacial adhesion,possibly because of the largest deposition rate.
关 键 词:磁过滤电弧离子镀技术 TIN薄膜 偏压 磁过滤电流
分 类 号:TB43[一般工业技术] TG115.21[金属学及工艺—物理冶金]
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