CMP过程中抛光垫表面沟槽对液膜厚度影响研究  

Study on polishing pad surface groove on the thickness of slurry film during CMP

作　　者：钟静[1] 魏昕[1] 谢小柱[1] 杨向东[1] 

机构地区：[1]广东工业大学机电工程学院,广东广州510006

出　　处：《制造技术与机床》2015年第5期92-96,共5页Manufacturing Technology & Machine Tool

基　　金：国家自然科学基金项目(51175092);教育部高校博士学科专项科研基金项目(20104420110002);广东省自然科学基金项目(10151009001000036);广东省科技计划项目促进科技服务业发展专项计划(2010A040203002);省部产学研结合科技创新平台(2011A091000002)

摘　　要：抛光垫表面沟槽结构是决定抛光液抛光效果的重要因素之一。为了研究抛光垫表面沟槽对化学机械抛光过程的影响,设计并搭建了高速摄影仪在线检测平台,检测并研究了有无沟槽及不同类型沟槽结构对液膜厚度的影响。实验结果表明:抛光垫开槽可以增加抛光液液膜厚度分布均匀性;在同心圆型、放射型、网格型、复合型4种类型抛光垫结构中复合型沟槽具有最优抛光效果。Polishing pad grooving is one of the most important elements for polishing liquid polishing perform- ances. To study the effects of polishing pad grooving on chemical mechanical polishing, a high - speed camera online testing platform is designed and built. The influences of polishing pad without grooves and with groove on the slurry film thickness are studied. The experimental results show that the polishing pad groove can increase the polishing liquid slurry film thickness distribution uniformity; complex groove can get the best polishing effect in four types of polishing pad, which are concentric circular, radiation type, mesh type and compound type.

关 键 词：化学机械抛光 抛光垫沟槽 液膜厚度 

分 类 号：TG506[金属学及工艺—金属切削加工及机床]