超薄不锈钢基板化学机械抛光运动机理分析  

An Analysis of Kinematic Mechanism on Ultra-thin Stainless Steel Substrate in Chemical Mechanical Polishing

作　　者：杨向东[1] 魏昕[1] 谢小柱[1] 胡伟[1] 

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《组合机床与自动化加工技术》2015年第5期27-30,共4页Modular Machine Tool & Automatic Manufacturing Technique

基　　金：国家自然科学基金项目(51175092);教育部高校博士学科专项科研基金项目(20104420110002);广东省自然科学基金项目(10151009001000036)

摘　　要：从运动学角度出发,根据超薄不锈钢基板与抛光垫化学机械抛光过程中的运动关系,通过分析磨粒在不锈钢基板表面的运动轨迹,揭示了抛光垫和不锈钢基板的转速和转向等参数对超薄不锈钢基板表面材料去除率和非均匀性的影响。分析结果表明:超薄不锈钢基板与抛光垫转速近似相等、转向相同时可获得最佳的材料去除率及材料去除非均匀性。研究结果为CMP机床设计、CMP运动参数的自动控制和进一步理解CMP的材料去除机理提供了技术和理论依据。In this paper the kinematic relationships between ultra-thin stainless steel substrate with the polishing pad in the chemical mechanical polishing process are calculated. The parameters of the rotational speed of the polishing pad and the stainless steel substrate ＇s impact to the ultra-thin stainless steel surface＇s material removal rate and non-uniformity are revealed by analyzing the abrasive grains in the surface of the stainless steel substrate trajectory. The analysis results showthat： when the ultra-thin stainless steel substrate and the polishing pad speed are approximately equal and its steering directions are the same can get the best material material removal rate and materical removal uniformity. The analytical results provide technical and theoretical guide to design the CMP equipments,the automatic control of kinematic parameters in CMP and further understanding of the material removal mechanism of ultra-thin stainless steel substrate in CMP.

关 键 词：超薄不锈钢基板 化学机械抛光 材料去除机理 材料去除率 非均匀性 

分 类 号：TH122[机械工程—机械设计及理论] TG506[金属学及工艺—金属切削加工及机床]