基于钙硼硅系LTCC生瓷带微波基板制造技术  

Manufacturing Technology of Microwave Substrate Based on CaO-B_2O_3-SiO_2 System LTCC Green Tape

作　　者：谢廉忠[1] 严伟[1] 房迅雷[1] 

机构地区：[1]南京电子技术研究所,南京210039

出　　处：《现代雷达》2015年第5期53-55,60,共4页Modern Radar

摘　　要：低温共烧陶瓷(LTCC)技术可以实现真正意义上的三维微波互连基板,已经成为实现机载、星载、舰载相控阵雷达收/发组件小型化、轻量化、高性能、高可靠和低成本的理想方法之一。文中对基于国产钙硼硅系LTCC生瓷带微波基板制造技术进行了深入研究,剖析了影响基板外形尺寸和腔体翘曲度的工艺因素,提出了相应的解决方法。LTCC provide the capability for true three-dimensional microwave interconnection substrates, and has become an ideal method for realizing small size, lightweight, high performance, high reliability and low-cost T/R modules for air-borne, satellite- borne and ship-borne phased array radars. In this paper, the manufacturing technology of microwave substrate based on national CaO-B2O3-SiO2 system LTCC green tape is studied, the technology factors which influence the substrate size and cavity warping are analyzed, and the relevant solutions are suggested.

关 键 词：钙硼硅 LTCC 微波基板 收/发组件 相控阵雷达 

分 类 号：TN958.92[电子电信—信号与信息处理]