跌落过程中焊点的有限元模拟  

Finite Element Analysis on Solder Joint in Free Fall

作　　者：郑菲[1,2] 郑才国[2] 

机构地区：[1]成都理工大学地球物理学院,四川成都610059 [2]成都理工大学工程技术学院,四川乐山610047

出　　处：《机械设计与制造》2015年第6期52-54,共3页Machinery Design & Manufacture

基　　金：校青年科研基金项目(C122014023)

摘　　要：电子封装是连接电子系统和半导体芯片的一个纽带,焊球的破坏会导致整个封装结构的失效。随着便携式电子设备的不断普及,电子封装结构在跌落冲击过程中的可靠性逐渐成为研究的重点,建立了BGA封装跌落问题的三维有限元分析模型,模拟了水平自由跌落、垂直自由跌落和以任意角度自由跌落三种状态下PCB板的应变分布和焊球的应力应变情况,用以研究焊球的可靠性,并对三种不同跌落状况进行对比分析,模拟分析表明水平自由跌落状况最为危险,因此在真实跌落试验中建议采用此种跌落方式进行试验。Electronic packaging is a bridge correcting the semiconductor chip and electronic systems. A solder ball damage often leads to the failure of the whole packaging structure. With the popularity of portable electronic devices, the reliability of electronic encapsulation structure under drop impact process gradually become the focus of the study. Established three- dimensianal finite element analysis model of the BGA encapsulation drop problem and simulate the strain distribution of PCB and the stress and strain situation of the welding ball under the three states of the horizontal free fall, vertical free fall and free fall in an arbitrary angle. Study the reliability of solder balls, and a comparative analysis of three different drops, simulation analysis indicates that it is the most dangerous condition of level of free falling, so the fail in the real drop tests recommended way to expertment.

关 键 词：焊锡接点 跌落试验 电子封装 有限元 

分 类 号：TH16[机械工程—机械制造及自动化] TB12[理学—工程力学]