LCD驱动芯片CoF封装技术的现状及发展  

Research Status and Perspective of CoF Package Technology for LCD Drive IC

作　　者：胡张琪 王健 郭函[1] 陈瑜[1] 崔成强 王锋伟 蔡坚[1] 

机构地区：[1]清华大学微电子学研究所,北京100084 [2]安捷利电子科技(苏州)有限公司,江苏苏州215129

出　　处：《电子与封装》2015年第6期1-8,共8页Electronics & Packaging

基　　金：国家科技重大专项(2014ZX02503)

摘　　要：挠性封装基板具有可弯折、重量轻、厚度薄等特点。基于挠性基板的CoF互连技术逐渐成为薄膜晶体管液晶显示屏(TFT-LCD)驱动芯片的主流封装技术。针对液晶显示系统中驱动芯片CoF封装技术的4种主要互连技术——ACA连接技术、NCA连接技术、焊料连接技术和金-金热压技术的原理、特点、研究现状和发展前景进行了总结,提出了未来CoF互连技术可能出现的新工艺和发展方向。The flexible packaging substrate is characterized by its flexibility, light wight and thin thickness. The CoF interconnection technology based on FPC has become the mainstream technology for LCD Drive IC. In the paper, the principium,characteristic, research status and perspective of four main interconnection methods including ACA, NCA, solderinterconnection and Au-Au Termocompression are reviewed. A possible new interconnection method and the perspective of CoF packaging are also presented.

关 键 词：CoF封装 各向异性导电胶 非导电胶 金-金热压 驱动芯片 

分 类 号：TN305.94[电子电信—物理电子学]