功率器件自动控温定位塑封系统的设计  

Design of automatic temperature and positioning control device in semiconductor encapsulation system

作　　者：余骏华[1] 孙力[1] 全庆霄 

机构地区：[1]江南大学物联网工程学院,江苏无锡214122 [2]江阴苏阳电子股份有限公司,江苏江阴214421

出　　处：《现代电子技术》2015年第14期116-119,共4页Modern Electronics Technique

摘　　要：为了满足功率器件不同封装形式可靠性和稳定性的需求,对功率器件封装的塑封系统进行研究。设计塑封压机集成接口和PLC温度控制电路,实现功率器件塑封压机温度控制;研发光电传感器、接近传感器以及螺旋测试头集合形成的塑封模具定位传感结构,结合PLC定位电路设计,实现了功率器件塑封模具定位。对关键的PLC和触摸屏组合控制系统进行了探索,系统已投入实际应用,效果良好。In order to satisfy the reliability and stability requirements of semiconductor power device package in different forms,the plastic encapsulation system of power devices is studied. The integrated interface and PLC temperature control circuit of the plastic encapsulation press were designed. The positioning sensing structure of the encapsulation mould made up by photo-electric sensor,proximity sensor and spiral tester was developed. Combined with PLC position control circuit,the positioning function of encapsulation moulds was realized. The assembly control system of PLC and touch screen is explored. The system has been used in practical application. Its effect is quite satisfied.

关 键 词：功率器件 封装 温度控制 定位 

分 类 号：TN305.94[电子电信—物理电子学]