PCB加工对覆铜板CTI影响及机理分析  

The analysis of the infl uence and mechanism of PCB manufacturing to CTI of CCL

作　　者：王创甜[1] 温东华[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《印制电路信息》2015年第2期24-26,45,共4页Printed Circuit Information

摘　　要：模拟PCB工厂加工高CTI覆铜板过程。从材料规格的选择到PCB加工的整体加工进行分析对板材CTI的影响。PCB从材料选择,材料的铜厚、CTI树脂层厚度均对板子的CTI产生影响;PCB加工的不同工序对CTI表层树脂层也会造成板子CTI的变化。This paper made simulation of PCB plant processing high CTI copper clad laminate process with the whole processing process from the selection of material specif ications to PCB processing respectively, analyzed the inf luence of CTI sheets. The factors of material selection, material thickness of copper, CTI resin layer thickness all affected board CTI. The change of different processes on the CTI during PCB processing including surface resin layer can also cause CTI change.

关 键 词：高相比漏电痕迹指数 覆铜板 印制电路板加工 粗糙度 铜厚 树脂厚度 

分 类 号：TN41[电子电信—微电子学与固体电子学]