高厚径比多种孔径选择性树脂塞孔工艺研究  

Process research of high AR complex-hole selective resin plugging

作　　者：刘秋华[1] 牟冬[1] 方庆玲[1] 丁杨[1] 罗琳[1] 许梦[1] 

机构地区：[1]江南计算技术研究所,江苏无锡214083

出　　处：《印制电路信息》2015年第7期28-31,44,共5页Printed Circuit Information

摘　　要：文章通过选择合适的刮胶、设计树脂塞孔模板、优化刮印及固化参数,利用丝网印刷技术进行电路板树脂塞孔的制作技巧。通过应用这些技巧实现了0.15mm^0.60mm孔径范围内高厚径比孔的无空洞、无凹陷塞孔。并对这些技术进行了实验验证。This article shows PCB resin-plughole technology, using screen-printing technique, which mainly reflected in several aspects such as selection of squeegee, design of plughole template, optimization of squeegee parameters and cure parameters, etc. By applying these techniques, our company realized high aspect ratio of PCB resin-plughole, while no bubbles and depressions, in the range of pore size from 0.15 mm to 0.60 mm. And these technologies have been tested by experiments that followed.

关 键 词：高厚径比 多孔径 选择性树脂塞孔 塞孔模板 塞孔刮胶 

分 类 号：TN41[电子电信—微电子学与固体电子学]