新型添加剂对酸性镀铜的影响  

Effects of New-Type Additive on Acid Copper Plating

作　　者：程骄 聂文杰 李卫民 

机构地区：[1]广东东硕科技有限公司,广东广州510288

出　　处：《电镀与环保》2015年第4期15-17,共3页Electroplating & Pollution Control

摘　　要：研究了酸铜电镀药水的沉积作用机制。采用极化曲线、扫描电子显微镜、金相显微镜等检测方法,分析了添加剂对电沉积过程的影响,并阐述了添加剂与镀层延展性之间的关系。The action mechanism of acid plating solution during copper deposition was investigated. Effects of additive on the electrodeposition process were analyzed by polarization curve, scanning electron microscope and metallographic microscope, and the relationship between additive and coating ductility was also elaborated.

关 键 词：镀铜 深镀能力 添加剂 电化学性能 

分 类 号：TQ153[化学工程—电化学工业]