浅谈曲面直写式光刻工艺  

Simply Talking about Direct Writing Lithography Process on Curved Surface

作　　者：甄万财[1] 孙明睿[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2015年第6期41-44,共4页Equipment for Electronic Products Manufacturing

摘　　要：针对一些曲面栅网器件的加工工艺,从实验装置、光刻原理、光刻工艺及参数要求等方面进行了分析,为后续深入开展曲面直写式光刻工艺打下了基础。According to the lithography process of some curved surface grid device, analyses are carried on from experiment equipment,lithography theory,lithography process and parameter requirements,and intense curved surface direct writing lithography process could be developed based on them afterwards.

关 键 词：半导体设备 曲面 直写式 光刻 

分 类 号：TN305.7[电子电信—物理电子学]