激光刻蚀聚酰亚胺基底铝薄膜的温度场模拟  

Simulation of Temperature Field for Laser Etching of Aluminum Thin Films on Polyimide Substrate

作　　者：刘孝丽[1] 熊玉卿[1] 杨建平[1] 王瑞[1] 吴敢[1] 任妮[1] 

机构地区：[1]兰州空间技术物理研究所真空技术与物理重点实验室,甘肃兰州730000

出　　处：《中国激光》2015年第7期112-116,共5页Chinese Journal of Lasers

基　　金：国家自然科学基金(51135005)

摘　　要：为了研究1064 nm激光刻蚀聚酰亚胺基底镀铝薄膜的作用机理,采用有限元分析软件ANSYS模拟了激光对聚酰亚胺基底上铝薄膜的刻蚀过程,分析了激光脉冲作用于铝薄膜表面时的能量传输及转化过程,获得了铝薄膜及聚酰亚胺基底中的温度场分布,进一步验证了在脉冲激光作用下由于基底材料易分解而产生的薄膜/基底界面分离机制。In order to study 1064 nm laser etching mechanism for aluminum thin films on polyimide substrate,the etching process of aluminum thin films is simulated by finite element analysis software ANSYS. By analyzing the laser energy absorbing and transforming process within aluminum thin films, temperature field distribution of thin films induced by laser ablation is obtained, and the separation mechanism of aluminum thin films from polyimide substrate resulted by the decomposability of polyimide is verified.

关 键 词：薄膜 激光刻蚀 铝薄膜 聚酰亚胺 温度场 分离机制 

分 类 号：O437[机械工程—光学工程]