基于垂直互连技术的上下变频多芯片模块  

Up-down Converter Multichip Module Based on the Vertical Connection Technique

作　　者：董毅敏[1] 厉志强 朱菲菲[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2015年第8期580-584,共5页Semiconductor Technology

摘　　要：采用垂直互连技术研制了一种X波段上下变频多芯片模块,实现了微波单片集成电路和介质基板在三维微波互连结构中的平稳转换、保证了微波信号的有效传输。简要分析了垂直互连对微波传输的影响和解决方法,应用微波仿真软件建立了互联结构的三维电磁场模型,对垂直互连结构进行了仿真优化。实测结果和仿真结果吻合良好。最后在较小尺寸盒体内实现了上变频链路、下变频链路、电源管理、TTL检测四个功能。模块测试结果表明,下变频链路的变频增益大于51dB,噪声系数小于6dB,杂散抑制小于65dBc;上变频链路的变频增益大于9dB,1dB压缩点输出功率大于11dBm,杂散抑制小于55dBc;模块尺寸为80mm×42mm×15mm,达到了小型化设计要求。An X band up-down converter multichip module was developed by using the vertical in- terconnection technology. The stable conversion of microwave monolithic integrated circuit （MMIC） and media substrate in 3D microwave interconnection structure was realized. And the effective transmission of microwave signal was ensured. The influence of vertical interconnection on microwave transmission and its solutions were briefly analyzed. A 3D electromagnetic field model of the interconnection structure was set up by microwave simulation software, and the vertical intereonnection was optimized. The test results agree well with the simulation results. The functions of up-converter-link, down-converter-link, power management and TTL detection were achieved in a miniature size box. The test results show that the down-converter channel conversion gain is above 51 dB, the noise figure below 6 dB, and the clutter suppression below 65 dBc, the conversion gain of the up-converter-link is above 9 dB, the output power at the 1 dB compress point above 11 dBm, and the spur suppression ratio below 55 dBc. The module size is 80mm×42mm×15mm, meeting miniaturization requirement.

关 键 词：垂直微波互连 多芯片模块 上下变频 混频器 MMIC 

分 类 号：TN454[电子电信—微电子学与固体电子学]