ICT融合趋势下的半导体技术和市场发展趋势  

The Development Tendency of Semiconductor Technology and Marketing in ICT

作　　者：王晓明[1] 

机构地区：[1]中兴通讯股份有限公司,深圳518057

出　　处：《中兴通讯技术》2015年第4期51-57,共7页ZTE Technology Journal

摘　　要：认为ICT产业和半导体产业的发展交互影响:ICT产业是中国半导体产业的核心市场方向,而半导体产业的发展将推动ICT加速融合。ICT产业浪潮将围绕下一代信息技术,包括物联网、超高速宽带通信网络,下一代移动通信(5G)、网络与信息安全等。根据ICT产业发展方向,得出芯片架构软件定义化、低功率、封装技术先进化是半导体技术发展的主要趋势。认为中国半导体产业面临重大的机遇和挑战,需要抓住新的产业机会,实现更大发展。ICT industry is the core of China's semiconductor industry, while the development of semiconductor industry will promote the integration of ICT. The development of ICT industry will focus on the next generation of information technology, including the Internet of Things, ultrahigh-speed broadband communication network, next-generation mobile communication(5G), and network and information security. Software-defined chip architecture, power efficiency, and advanced packaging technology are the main trends in semiconductor technology. We believe that China's semiconductor industry is facing great opportunities and challenges, and we need to seize the new opportunities and achieve greater development.

关 键 词：半导体 集成电路 信息通信技术 芯片架构 芯片封装 

分 类 号：F416.63[经济管理—产业经济] TN4-1[电子电信—微电子学与固体电子学]