印制电路板及电子封装今后的技术发展  

Technologies for PCB and electronic package in the future

作　　者：田民波[1] 

机构地区：[1]清华大学,北京100084

出　　处：《印制电路信息》2015年第9期46-50,共5页Printed Circuit Information

摘　　要：ITRS2012路线图表明半导体芯片继续向微细化、多端子、高速化方向发展,与此同时,电子封装正从2维向3维转变。无论对于封装基板、插入板、母板还是背板来说在形式、结构、制作方法、加工工艺、特别是材料方面都要适应这种发展和转变。文章介绍了印制线路板及电子封装今后的技术发展。The ITRS 2012 ROAD MAP describes that IC chip will develop of IC chip to fine pitch, more I/O pinns, high speed continuously, as well as that the electronic packages are transforming from 2 maintain to 3 maintain. No matter for package substrate, inter poser, mother board, or for backplane board, the forms, structures, manufacture processes and technologies must suit the development and transformation. This paper introduces technologies for PCB and electronic package in the future.

关 键 词：ITRS 2012路线图 组抗匹配 封装基板 插入板 3D封装 无孔盘PCB 

分 类 号：TN41[电子电信—微电子学与固体电子学]