SIP技术的发展与应用  

The development and application of SIP technology

作　　者：陈悦[1] 周晓宁[1] 季秀霞[1] 

机构地区：[1]南京航空航天大学金城学院,江苏南京211156

出　　处：《印制电路信息》2015年第9期51-53,共3页Printed Circuit Information

摘　　要：系统级芯片(SoC)发展到深次微米以下后遇到极大的技术发展瓶颈,随后系统级封装(SIP)的出现被学术界和工业界广泛接受,它将封装的内涵由简单的器件保护盒功能扩展到实现系统或子系统功能,成为半导体技术发展的重要方向。文章详细介绍了系统级封装技术及Cadence SIP软件,并通过婴儿恒温箱的设计实例说明系统级封装相对于传统设计的优势。System on chip（SoC） encounters great technology development bottleneck when it develops to deep sub micron. After that System-in-Package（SIP） is widely accepted in the academic and industrial circles. It will package the connotation by the simple device protection box function with extension to realize the function of system or subsystem. It becomes an important direction of the development of semiconductor technology. In this paper, System-in-Packaging technology and SIP Cadence software are illustrated in more details, and the advantages of System-in-Package relative to the traditional design are illustrated by the example of baby incubator.

关 键 词：系统级封装 CADENCE SIP软件 婴儿恒温箱 系统级芯片 

分 类 号：TP311[自动化与计算机技术—计算机软件与理论]