双列直插型DC／DC电源模块内引线焊接结构热应力分析  

Thermal Stress Analysis of Internal Lead Soldering Structure in DC/DC Power Module with Dual in -Line Package

作　　者：董晓伟[1] 阚元辉 刘俊夫[1] 郑静[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2015年第1期41-45,共5页Hybrid Microelectronics Technology

摘　　要：通过温度循环、热冲击环境试验，热应力有限元分析，得到了双列直插型DC／DC电源模块内引线焊接结构在温变环境荷载作用下的热应力场分布图，结果表明封装管壳与陶瓷基板间的热膨胀系数不匹配是导致热应力积累的主要原因，并得出损伤裂纹发生的机理。在此基础上，给出了内引线焊接结构的优化模型和电源模块设计封装管壳的优选建议，通过环境试验和理论分析，证明了优化模型的可靠性有了极大提高。Through temperature cycling, thermal shock environmental testing and thermal stress finite element analysis meth- od, the thermal stress distribution profile of lead soldering structure for dual in - line DC/DC power module under the temperature changing of environmental load is obtained. The results show that the major reason of thermal stress accumulation is metal package and ceramic substrate thermal expansion coefficient mismatch caused deformation mismatch. At the same time, the mechanism of damage crack is described. On this basis, the optimization model of lead soldering structures and preferred proposal of metal pack- age for power module design are given. Through environmental testing and theoretical analysis ,we prove the reliability of the opti- mization model has been greatly improved.

关 键 词：DC/DC电源 金属封装 热应力分析 可靠性 有限元 

分 类 号：TM46[电气工程—电器]