黑孔化直接电镀技术的发展与展望  

Development and Prospect of the Black Hole Direct Plating Technology

作　　者：遇世友[1] 李宁[1] 汪浩[1] 黎德育[1] 

机构地区：[1]哈尔滨工业大学化工学院,黑龙江哈尔滨150001

出　　处：《电镀与环保》2015年第5期1-4,共4页Electroplating & Pollution Control

摘　　要：黑孔化直接电镀是一种先进的印刷线路板孔金属化技术。对黑孔化直接电镀技术的产生和发展进行了阐述。对电荷调整和导电液处理这两个关键环节的作用进行了分析。结合近期国内外碳材料导电薄膜研究取得的成果,探讨了黑孔化直接电镀技术的发展趋势。Black hole direct plating is an advanced hole metallization technology for printed circuit board. The advent and development of black hole direct plating technology were elaborated, and the functions of two key process steps, that is, charge adjustment and electrically conductive fluid treatment, were analyzed. Furthermore, the development trend of black hole direct plating technology was discussed combining the latest worldwide research results on carbon material conductive films.

关 键 词：黑孔化 直接电镀 孔金属化 印刷线路板 

分 类 号：TQ153[化学工程—电化学工业]